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Honeywell is Hiring For Embedded Engineer II Salary 5 LPA

Honeywell is Hiring 2020-2023 Batch Pass outs Students

Honeywell job

About Company

Honeywell International Inc (Honeywell) is an engineering and technology company. The company invents and manufactures technologies that address challenges in various sectors including energy, security, safety, productivity, and global urbanization.

ur global businesses have a strong legacy in India, built over the last eight decades. Honeywell’s commitment in India is evident in three state-of-the-art manufacturing facilities and four global centers of excellence for technology development and innovation. We employ close to 13,000 people across 20 locations, including Bengaluru, Chennai, Dehradun, Delhi, Gurugram, Hyderabad, Kolkata, Madurai, Mumbai, Pune and Vadodara.

Honeywell Embedded Engineer II Recruitment Details

Company Honeywell
Post Embedded Engineer II
Degree BE/B. Tech,/M.E/M.Tech/MCA
Branch All Branch
Batch 2020/2021/2022/2023 Batch
CTC Rs 5 LPA (Expected)
Location Bangalore

Job Description

Behavioral Expectation:

  • Result oriented and Team Player attitude.
  • Ability to adapt to changing environment.
  • Adapt agile process/methodologies as needed.
  • Openness to work across programs/products/teams.

Who Can Apply

Software Developer (Embedded)

Qualifications:

  • BE/B. Tech, M.E/M. Tech/MCA
  • Experience: 0-2 years

Essential Skills (Must Have):

  • Proficient in C/C++. Exposure to Ada is preferrable.
  • Understanding of Real Time Operating Systems and Cross Compilers
  • Knowledge / Experience in application of Data structures/Design Principles.
  • Knowledge / Experience in Development/Unit/SW-SW Integration testing
  • Strong Code Review/ Code Debugging / Troubleshooting skills.
  • Exposure to industry standard Change management and Configuration Management practices

General Skills (Good to Have):

  • Possess Sound knowledge on software product development.
  • Development Tools: Visual Studio, Other IDEs, Cross Compilers
  • RTOS: VxWorks, DEOS
  • Configuration Management:  Serena Dimensions, ClearCase/ClearQuest, Bitbucket/JIRA
  • Scripting: DOS, Perl/Python
  • Good oral, written communication, coordination, and presentation skills.

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Placement Materials

TCS Study Material :- Coming Soon

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Apptitude Study Material :- Coming Soon

Selection Process

Round 1

In first round there will Aptitude Round where question related to check capabilities of the candidate through variety of questions like

  • Verbal reasoning questions. …
  • Verbal comprehension questions. …
  • English language questions. …
  • Questions testing abstract reasoning.

Round 2

The second round is generally a Technical Round in which all the technical related question were asked to candidate according to job role. In this generally the interviewer checks candidate technical ability the depth and breadth of candidaate knowledge

Round 3

Round 3 is a HR round in some cases TR and HR round are occur concurrently. This round is conducted by Human Resource Professional who ensures that you are the right candidate for the role


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